Key facts
- Samsung Electronics anticipates its foundry customer base could quadruple by 2029 compared to 2017 levels.
- The company aims to shift its foundry focus from mobile products to artificial intelligence (AI) and high-performance computing (HPC).
- HPC's share of the foundry business has grown from 5% in 2017 to 28%, with expectations to exceed 50% by 2029.
- Samsung plans to commence mass production of its 2-nanometer process in 2028 and 1.4-nanometer process in 2029.
- The company is expanding its semiconductor manufacturing presence in Texas with a new fab complex.
Samsung Electronics Co. anticipates a significant expansion in its foundry business, projecting its customer base could quadruple by 2029 compared to 2017 levels. Noh Mi-jung, a senior vice president at Samsung's foundry business, stated during Korea Premium Week 2026 that customer numbers have already increased threefold since the business was established as an independent unit in 2017.
The company is strategically shifting its foundry portfolio away from its current focus on mobile products towards artificial intelligence (AI) and high-performance computing (HPC). HPC's contribution to the foundry business has already grown substantially, from 5% in 2017 to 28% currently. Samsung expects this trend to continue, with HPC accounting for more than half of its customer base and sales by 2029.
To support this growth and technological advancement, Samsung plans to begin mass production of its third-generation 2-nanometer process in 2028, followed by its 1.4-nanometer process in 2029. The South Korean tech giant is also expanding its manufacturing capabilities in the United States, with initial operations at the first fab of its Taylor, Texas semiconductor complex planned for the end of the year. Construction of a second fab at the same site is also slated to begin within the year, targeting mass production by 2030.