Broadcom, Toppan open Singapore's first advanced chip substrate facility

Key facts

• Broadcom and Toppan Holdings opened Singapore's first advanced chip substrate facility.
• The facility is named Advanced Substrate Technologies (AST).
• AST specializes in designing and manufacturing advanced Flip Chip Ball Grid Array (FC-BGA) substrates.
• The substrates are for cutting-edge semiconductor applications, including network switches and AI/ML devices.
• The facility is Toppan's first FC-BGA manufacturing venture outside Japan.
• The facility integrates state-of-the-art automation and R&D.

U.S. chipmaker Broadcom and Japan's Toppan Holdings have opened Singapore's first advanced chip substrate manufacturing facility, Advanced Substrate Technologies (AST), ahead of schedule. The joint venture aims to bolster the global AI supply chain by producing high-quality Flip Chip Ball Grid Array (FC-BGA) substrates for AI/ML devices and network switches.

AST is Toppan's first FC-BGA manufacturing venture outside Japan and integrates state-of-the-art automation and R&D to meet global demand. The company's vision is to be a global leader in advanced substrate technologies, driving innovation for next-generation semiconductor solutions while fostering a sustainable and collaborative industry ecosystem.