Broadcom and Toppan Holdings have opened Singapore's first advanced chip substrate manufacturing facility, Advanced Substrate Technologies (AST), ahead of schedule. The joint venture aims to bolster the global AI supply chain by producing high-quality Flip Chip Ball Grid Array (FC-BGA) substrates for AI/ML devices and network switches.
The opening of this advanced chip substrate facility addresses a critical bottleneck in the AI supply chain, potentially easing constraints on the production of AI-focused semiconductors and supporting the growth of the artificial intelligence industry.
U.S. chipmaker Broadcom and Japan's Toppan Holdings have opened Singapore's first advanced chip substrate manufacturing facility, Advanced Substrate Technologies (AST), ahead of schedule. The joint venture aims to bolster the global AI supply chain by producing high-quality Flip Chip Ball Grid Array (FC-BGA) substrates for AI/ML devices and network switches.
AST is Toppan's first FC-BGA manufacturing venture outside Japan and integrates state-of-the-art automation and R&D to meet global demand. The company's vision is to be a global leader in advanced substrate technologies, driving innovation for next-generation semiconductor solutions while fostering a sustainable and collaborative industry ecosystem.
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