GlobalFoundries to make AI chip component for TSMC in New York

• GlobalFoundries will manufacture silicon interposers for TSMC at its Malta, New York facility.
• The agreement is valued at $2 billion and has an initial term of five years.
• This deal establishes the first U.S.-based source for silicon interposers used in advanced AI packaging.
• Volume production is expected to begin ramping up in the first half of 2028.
• Silicon interposers are critical components that sit beneath processors and memory chips in advanced AI packages, enabling high-speed communication.

GlobalFoundries has entered into a five-year, $2 billion agreement with TSMC to manufacture silicon interposers at its facility in Malta, New York. This deal marks the establishment of the first U.S.-based supply of these critical components, which are essential for advanced AI and high-performance computing chip packaging.

Under the agreement, GlobalFoundries will provide manufacturing services to TSMC, expanding its fabrication capacity at the New York site. These silicon interposers are designed to sit between processors and memory chips within advanced chip packages, facilitating high-speed communication between them. The agreement is structured to allow for future capacity expansion as demand grows.

Volume production is anticipated to commence in the first half of 2028. Ed Kaste, senior vice president of CMOS Business at GlobalFoundries, highlighted the increasing importance of advanced packaging for next-generation AI systems and stated that the secure, scalable source of these elements will help accelerate innovation and strengthen the semiconductor supply chain.