Key facts
- Applied Materials is using AI to speed up the discovery of new materials for semiconductor manufacturing.
- The company's AIx platform offers real-time process insights and optimization for semiconductor manufacturing.
- New Applied Materials systems target leading-edge logic, high-performance DRAM, and advanced packaging for AI chips.
- AI workloads are driving demand for improved computing capability and energy efficiency in chips.
- Applied Materials aims to contribute to breakthroughs as current chip miniaturization technology approaches its limits.
Applied Materials is employing artificial intelligence to accelerate the discovery of new materials essential for the advancement of semiconductor technology, according to the company's top executive in Japan. The company believes that new materials are necessary as current chip miniaturization techniques are nearing their physical limits.
The AIx™ platform, or Actionable Insight Accelerator, is designed to provide semiconductor engineers with real-time visibility into manufacturing processes. It enables the analysis of millions of measurements across wafers and individual chips, facilitating the optimization of thousands of process variables. This optimization aims to enhance semiconductor performance, power consumption, area, cost, and reduce time to market. The AIx platform is compatible with all Applied Materials process equipment and metrology systems, and can be used from research and development through to high-volume manufacturing.
Applied Materials' strategy focuses on 'inflection-focused innovation,' recognizing the critical role of foundational semiconductor technology in improving AI computing capabilities and reducing its cost. The company highlights five key areas for leadership in AI systems: leading-edge logic, high-performance DRAM, high-bandwidth memory (HBM), advanced packaging, and power electronics. These advancements are crucial as AI data centers are projected to consume over 10% of global electricity by 2030, underscoring the need for energy-efficient computing.
In October 2025, Applied Materials introduced new manufacturing systems, including the Kinex™ bonding system for hybrid bonding, the Xtera™ system for advanced transistors, and the PROVision™ 10 eBeam metrology system. These products are designed to enhance the performance and power efficiency of advanced logic and memory chips, particularly for AI applications, by enabling more complex chip designs and integrated systems-in-a-package.