Key facts
- Huawei has shipped over 100 million devices with Kirin chips since 2023.
- Testing of the next-generation Kirin 2027 chip is progressing.
- The Kirin 9050 series is the first to mass-produce Huawei's LogicFolding chip technology.
- Transistor density in the Kirin 9050 series increased by 53.5% over the prior generation.
- Energy efficiency of large CPU cores in the Kirin 9050 Pro increased by 41%.
- NPU computing power for the Kirin 9050 Pro jumped by 140%.
Huawei Technologies has announced a significant milestone, revealing that it has shipped over 100 million devices powered by its self-developed Kirin chips since 2023. This achievement comes as the company continues to navigate stringent US sanctions that have previously hampered its access to advanced semiconductor technologies.
At a chip technology briefing in Shanghai, Huawei disclosed details about its Kirin 9050 series, which represents the first mass production of its proprietary LogicFolding architecture. According to Xu Songyu, director of the Wireless Terminal Chip Product Management Department at Huawei Semiconductor Business, the Kirin 9050 series boasts a 53.5% increase in transistor density compared to its predecessor. Furthermore, the Kirin 9050 Pro model has seen a 41% improvement in the energy efficiency of its large CPU cores and a 140% surge in neural processing unit (NPU) computing power.
Huawei also indicated that testing for its next-generation Kirin 2027 chip is progressing as expected. The company plans to further refine its technology by shrinking the hybrid bonding pitch to 1 micrometer for future chips and exploring multi-layer LogicFolding. The company aims to match global semiconductor leaders like TSMC and Intel by 2031, with a spokesperson emphasizing the development of innovative design approaches to reduce reliance on foreign technologies.