Key facts
- He Tingbo, head of Huawei's secretive semiconductor business, has re-emerged publicly after seven years.
- She introduced the 'Tau (τ) Scaling Law' at a Shanghai symposium.
He Tingbo, head of Huawei's semiconductor business, introduced the 'Tau (τ) Scaling Law' at a Shanghai symposium. Huawei claims this law could enable transistor densities equivalent to 1.4nm processes by 2031 without advanced EUV lithography, sparking debate in the semiconductor industry.

Huawei's announcement of a new scaling law could represent a significant breakthrough in China's efforts to achieve semiconductor self-sufficiency, potentially circumventing U.S. sanctions and challenging established industry norms.
He Tingbo, the head of Huawei Technologies' semiconductor business, has returned to the public eye after a seven-year absence, introducing a new technological concept that could significantly impact China's pursuit of tech self-reliance. Dubbed the "chip queen," He had been largely unseen since 2019 when U.S. sanctions cut off Huawei's access to advanced semiconductor technology.
At the IEEE International Symposium on Circuits and Systems in Shanghai last month, He unveiled the "Tau (τ) Scaling Law." Huawei asserts that this law could enable the company to achieve transistor densities equivalent to the cutting-edge 1.4-nanometre process by 2031. Crucially, this advancement is claimed to be achievable without the need for extreme ultraviolet (EUV) lithography machines, which are currently inaccessible to Huawei due to U.S. restrictions.
This announcement has ignited a fervent debate across the global semiconductor industry. Questions are being raised about whether Huawei has genuinely discovered a revolutionary path toward technological independence for China, or if the "Tau Scaling Law" is merely an ambitious theory or potentially exaggerated hype that may falter when confronted with the practicalities of mass manufacturing. For decades, Moore's Law, which predicted a doubling of transistors every two years, guided the industry, but as chip structures approach atomic limits, traditional geometric scaling has become increasingly challenging and economically less viable.
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