Key facts
- Huawei will launch two new AI semiconductors in 2027: the 960DT in Q1 and the Ascend 960PR in Q3.
- Huawei's UnifiedBus technology aims to link AI chips into larger computing systems.
- Huawei's superclusters can support up to 1 million AI processors.
- Huawei has shipped over 1,000 supernode systems to more than 370 customers.
- Huawei forecasts over 90% of AI token traffic will be driven by autonomous agents by 2035.
- Huawei's AI chip ecosystem has 5,270 monthly active developers.
Huawei Technologies plans to release two new artificial-intelligence semiconductors in 2027, as the Chinese tech giant seeks to expand its AI computing business and challenge U.S. chipmaker Nvidia. Rotating chairman David Wang announced that the 960DT chip will launch in the first quarter of 2027, followed by the Ascend 960PR in the third quarter.
The company is also developing technology to connect large numbers of AI chips into a single, larger computing system, addressing the need for increased processing power for advanced AI programs. Huawei's UnifiedBus technology is designed to enable chips to share information and collaborate more efficiently. Its largest linked systems, termed superclusters, can support up to 1 million AI processors, while smaller systems called supernodes have been shipped to over 370 customers.
These developments occur amidst a global competition between the U.S. and China in AI technology. U.S. export controls restrict China's access to advanced chips and manufacturing equipment, prompting Chinese companies like Huawei to focus on developing domestic alternatives. This situation makes chip interconnectivity crucial for Chinese firms seeking to maximize computing power from available local chips.
Huawei also forecasts that autonomous AI agents will drive over 90% of AI token traffic by 2035, requiring significant computing power and new security systems. The company's AI chip ecosystem currently has 5,270 monthly active developers.