Key facts
- SK Hynix's U.S. subsidiary, Solidigm, is considering building a NAND flash memory chip factory in the United States.
- Upstate New York is a leading candidate for the factory site.
- The facility would be Solidigm's first local manufacturing base.
- SK Hynix is also reportedly in talks with Intel regarding memory chip production in the U.S.
- SK Hynix is investing $4 billion in an advanced packaging plant in Indiana.
SK Hynix's U.S. subsidiary, Solidigm, is evaluating the construction of a NAND flash memory chip factory in the eastern United States, with upstate New York emerging as a primary candidate for the location. This potential facility would represent Solidigm's first local manufacturing base. Reports also indicate that SK Hynix is in discussions with Intel regarding a plan to produce memory chips in the U.S. for the first time, possibly by leasing a portion of a chip production facility that Intel is developing in Ohio. The South Korean chipmaker is already investing approximately $4 billion in an advanced packaging plant for next-generation high-bandwidth memory in West Lafayette, Indiana, with mass production slated for the latter half of 2029. This Indiana plant focuses on the back-end process of packaging DRAM chips, not wafer-level manufacturing. The potential U.S. production move by SK Hynix could be subject to review by the South Korean government if national core technologies are involved, though the company has stated that no final decisions have been made and that it is exploring various options to enhance global competitiveness. Intel has characterized the reports as speculation.