← Back to Home

South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment

Reuters
South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment

SEOUL, ‌Nov 12 (Reuters) - South ​Korean ‌President Lee ‌Jae Myung said ‌on Thursday that Samsung Electronics' 6 ⁠trillion ‌won ($4.48 billion) ⁠investment in a ​high-bandwidth memory chip ​packaging plant ​in ‌Asan, South ​Korea, ⁠would ‌be followed ​by ​about 40 trillion won in investment ‌in advanced ‌equipment.

($1 = 1,339.5500 ​won)

(Reporting by Joyce LeeEditing by ‌Ed Davies)