Key facts
- ASML plans to supply its most advanced High NA EUV lithography tools to major chipmakers.
- TSMC aims to begin mass production with these tools by 2030.
- Samsung targets 2028 for high-volume production of DRAM memory chips using High NA EUV.
- Intel is already utilizing ASML's newest tools for chip production.
- The High NA EUV machines are crucial for fabricating advanced chips for data centers and AI.
- ASML is the sole manufacturer of EUV lithography machines.
ASML, the Dutch manufacturer of critical chipmaking lithography tools, announced plans to collaborate with major customers like TSMC, Samsung Electronics, and Intel to deploy its most advanced High NA EUV machines. These tools are essential for producing the next generation of large data center chips designed by companies such as Nvidia.
TSMC intends to integrate this technology into its advanced-node high-volume production starting in 2030. Samsung Electronics is targeting 2028 for the high-volume production of DRAM memory chips using High NA EUV processes. Intel, meanwhile, has already begun mass production with these new tools for its laptop chips.
ASML's High NA EUV tools currently have a limitation on the size of the chip they can print due to a smaller mask. The company plans to address this by moving to a larger mask size, which will enable the production of chips as large as today's biggest data center chips and spur wider high-volume use of the new machines. ASML aims to showcase a pilot line with these larger masks by 2031, with technology ready for high-volume production by 2033. ASML's Chief Technology Officer, Marco Pieters, indicated that this industry-wide adoption could lead to a 40% increase in system productivity.