Key facts
- Besi shares fell 3% to €158.50.
- ASML shares were up 1.1% at €1,480.
- SemiAnalysis analyzed 27 patent filings by ASML indicating development of a hybrid bonding product.
Shares in BE Semiconductor Industries (Besi) fell 3% on Friday after SemiAnalysis reported that ASML is developing a hybrid bonding product, a technology crucial for creating advanced 3D chips. Besi, a leader in this area, is significantly smaller than ASML, a major semiconductor equipment maker. ASML has not confirmed the development but pointed to its launch of an advanced packaging tool last year and stated it continues to explore areas where its expertise can add value. In March, Reuters reported ASML was planning additional packaging tools. Analysts see these new tools as critical for ASML's growth and valuation.