Key facts
- Huawei's semiconductor chief He Tingbo introduced the 'Tau (τ) Scaling Law'.
- The law was unveiled at a symposium in Shanghai.
- Huawei claims the law could enable transistor densities equivalent to 1.4nm processes by 2031.
- The development reportedly does not require advanced EUV lithography.
- The 'Tau Scaling Law' focuses on signal travel time rather than transistor shrinking.
- Chinese chip design software firms, including Empyrean Technology, support the law.
- The strategy aims to bypass U.S. sanctions on advanced lithography equipment.
- Analysts caution that significant challenges remain in competing with U.S. rivals.
Huawei's semiconductor business head, He Tingbo, has unveiled a new chip development principle termed the "Tau (τ) Scaling Law." This law was introduced at a symposium held in Shanghai. Huawei asserts that this new scaling law has the potential to achieve transistor densities comparable to 1.4nm processes by the year 2031. A key aspect of this development is that it reportedly does not require advanced Extreme Ultraviolet (EUV) lithography, a technology that is subject to U.S. sanctions impacting China's access to cutting-edge semiconductor manufacturing equipment.