Schneider Electric, Foxconn Partner on AI Data Center Infrastructure

Schneider Electric and Taiwan's Hon Hai Technology Group, known as Foxconn, have entered a strategic collaboration to develop and scale infrastructure for next-generation artificial intelligence (AI) data centers. Production is slated to begin later this year.

The partnership aims to combine Hon Hai's expertise in manufacturing and AI systems with Schneider Electric's technologies in power, cooling, and energy management to deliver ready-to-deploy AI data center solutions. This collaboration addresses the growing demand for specialized infrastructure to support compute-intensive AI workloads.

The global data center equipment and infrastructure market was valued at $290 billion in 2024 and is projected to reach $1.01 trillion by 2030, with a compound annual growth rate of 23%. Key players in this market include Foxconn for server manufacturing, Schneider Electric for power and cooling, and Dell for IT hardware.

High-density AI clusters necessitate advanced thermal management, with a growing adoption of liquid-to-cooling technologies. NVIDIA's MGX platform specifications are also influencing product roadmaps for power and cooling vendors. Schneider Electric offers comprehensive AI data center solutions, including AI-ready designs and modular options, and collaborates with NVIDIA on reference designs for high-density AI cluster infrastructure.