Key facts
- Rivvor introduces sub-terahertz wireless interconnect technology.
- The technology is designed for AI data centers.
- It addresses connectivity challenges in high-density AI racks.
- The solution is engineered for both Earth and orbital applications.
Rivvor, a deep-tech startup, has introduced a sub-terahertz wireless interconnect technology aimed at AI data centers. This new solution is designed to integrate into the AI interconnect stack, providing an alternative to existing copper and optical links. The technology specifically targets the need for scale-up and scale-out connectivity within high-density AI racks. Rivvor's innovation is engineered for deployment in both terrestrial data centers and orbital environments.