Key facts
- Xiaomi has launched its new in-house Xring O3 smartphone processor.
- TSMC is expected to manufacture the chip using its 3-nanometer production technology.
- The Xring O3 is slated to power Xiaomi's upcoming flagship folding phone.
- Shipment targets for the folding phone are estimated between 200,000 and 300,000 units.
- Cumulative shipments of devices powered by the previous Xring O1 processor have exceeded 1 million units.
Chinese smartphone maker Xiaomi has unveiled its new in-house Xring O3 smartphone processor, aiming to strengthen its supply chain and reduce reliance on external chip suppliers. This move aligns with a broader industry trend where device makers are developing their own chips to differentiate products and compete in the premium smartphone market. TSMC is expected to manufacture the new chip using its advanced 3-nanometer production technology, according to sources familiar with the matter. The chip is slated to power Xiaomi's upcoming flagship folding phone, with shipment targets estimated between 200,000 and 300,000 units. This development follows Xiaomi's launch of its first proprietary processor, the Xring O1, in May 2025, which has seen cumulative shipments of over 1 million units across various devices including smartphones, tablets, and watches.