Key facts
- Xiaomi has launched a new version of its in-house Xring smartphone processor, the Xring O3.
- TSMC will reportedly manufacture the new chip using its 3-nanometer production technology.
- The chip is expected to power Xiaomi's upcoming flagship folding phone.
- Shipment targets for the folding phone are between 200,000 and 300,000 units.
- Cumulative shipments of devices powered by the previous Xring O1 processor have exceeded 1 million units.
Chinese smartphone maker Xiaomi has unveiled a new version of its in-house Xring smartphone processor, the Xring O3, as it seeks to strengthen its supply chain and reduce reliance on external chip suppliers. This move aligns with a broader industry trend where device makers are developing their own chips to differentiate products and compete in the premium smartphone market.