Key facts
- SUNMMIO follows a 3D stacked DRAM route.
- DRAM wafers are stacked directly on top of logic wafers.
Chinese AI chip startup SUNMMIO has raised nearly 2 billion yuan ($299 million) over the past year, reaching a valuation of 12 billion yuan after its latest funding rounds. The fundraising reflects a flow of capital into domestic chip developers seeking to close a computing supply gap amid surging AI demand and prolonged restrictions on imports of Nvidia Corp. chips. SUNMMIO follows the 3D stacked DRAM route, where DRAM wafers are stacked directly on top of logic wafers.
