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Space-Station Cooling Tech Adapted for AI Data Centers

Created at 30 Jul · 4:12 AM1 source↑ Market-relevant
IN SHORT

Researchers are adapting technology originally developed for the International Space Station to address heat dissipation challenges in AI data centers. This innovation aims to prevent overheating and "throttling" of computer equipment, which can lead to significant costs and performance issues.

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Key Numbers

5%IT sector's carbon footprint compared to air travel
100%compliance with ASHRAE recommended conditions for fresh air systems
90%potential reduction in cooling costs
5-kWpower for custom XPU customers
$540,000per hour in downtime costs from emergency thermal throttling
12%projected U.S. annual electricity consumption by data centers in 2030

Who's Involved

Caltech
research institution developing cooling technology
Sophia Space
startup developing cooling technology
Mikros Technologies
company adapting space-station cooling tech for AI data centers
Carbice Corporation
company providing thermal interface materials for AI data centers
Drew Matter
CEO of Mikros Technologies
Baratunde Cola
CEO of Carbice Corporation
Amazon
company that experienced a data center outage
Coinbase
cryptocurrency exchange impacted by Amazon data center outage
Broadcom
partnering with Mikros on next-gen AI accelerators
Jabil
acquired Mikros Technologies
Space-Station Cooling Tech Adapted for AI Data Centers

↳ Why This Matters

The adaptation of space-station cooling technology for AI data centers is critical as the demand for AI computing power escalates, placing immense pressure on energy resources and thermal management capabilities. This innovation could lead to more efficient, cost-effective, and sustainable data center operations, mitigating the risk of costly outages and reducing the environmental impact of the IT

Key facts

  • Technology originally developed for the International Space Station is being adapted to cool AI data centers.
  • The goal is to prevent overheating and "throttling" of computer equipment, which can cause performance degradation and downtime.
  • Increasing chip heat-emission issues are driving demand for advanced cooling solutions like liquid cooling and new thermal interface materials.
  • Data centers' electricity consumption is a growing concern, projected to rise substantially in the coming years.
  • Broadcom is collaborating with Mikros to integrate advanced thermal management into its next-generation AI accelerators.

Researchers are adapting technology originally developed for the International Space Station to address the growing challenge of heat dissipation in AI data centers. Companies like Mikros Technologies and Carbice Corporation are at the forefront of this effort, aiming to prevent the "throttling" of computer equipment caused by overheating.

Increasing chip heat-emission issues are driving demand for advanced cooling solutions, including liquid cooling and new thermal interface materials. These advancements are crucial as data centers consume a significant and growing portion of electricity, with projections indicating a substantial increase in their energy demand in the coming years. This trend is already stressing power grids.

Mikros Technologies, which previously designed cooling systems for the International Space Station, is now applying those principles to high-performance computing and AI. The company has partnered with Broadcom to integrate its thermal solutions into Broadcom's next-generation AI accelerators (XPUs). This collaboration aims to manage the extreme heat generated by these powerful chips.

Overheating in data centers can lead to "throttling," a process used to manage heat, power consumption, or traffic, which carries significant costs. Emergency thermal throttling due to servers overheating can result in substantial downtime costs. An example of such an issue occurred with an Amazon data center outage in Virginia on May 7, which impacted companies including the cryptocurrency exchange Coinbase.

Frequently asked questions

Throttling is a process data center operators use to manage heat, power consumption, or traffic by reducing the performance of computer equipment. While necessary to prevent overheating, it can lead to long-term performance degradation and reputation issues.

The increasing demand for AI computing power leads to higher chip heat emissions. Many data center cooling systems consume significant electricity, contributing to the IT sector's large carbon footprint and stressing power grids.

Technology developed for the harsh environment of space, where heat dissipation is critical for high-power-density electronics, is being repurposed for AI data centers. This leverages proven, robust solutions for extreme thermal challenges.

What Happens Next

01Mikros Technologies and Broadcom will continue to develop and integrate advanced thermal solutions for next-generation AI accelerators.
02Further research and development are expected in liquid cooling and new thermal interface materials for AI data centers.
03The impact of increased data center electricity demand on power grids will continue to be monitored.

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Cadence

How It Developed

Researchers at Caltech and Sophia Space developed solar-powered technology to prevent computer equipment from overheating in orbit.
Mikros Technologies and Carbice Corporation are adapting space-station technology for AI data centers.
Increasing chip heat-emission issues in AI data centers are driving demand for liquid cooling and new thermal interface materials.
The adapted technology is expected to help prevent "throttling" caused by overheating.
An Amazon data center in Virginia experienced an outage on May 7, impacting companies like Coinbase.
Data centers' electricity demand is projected to increase significantly in the coming years.
Broadcom is partnering with Mikros to develop next-generation XPUs, with Mikros providing thermal solutions.
Mikros, acquired by Jabil, is applying its past designs for the International Space Station to high-performance computing and AI.

Sources

T1
A.I. Data Centers in Space? A System to Cool Chips Could Help.The New York Times
T2
Orbital Data Centers: The Future of Space AI - Los Angeles Timeslatimes.com
T2
Data Centre Cooling - Data Centre Cooling Solutionsduckduckgo.com
T2
Space-Station Tech Pivots to Cool AI Data Centerseetimes.com

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