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SK Hynix to triple wafer capacity by 2034 amid AI demand

Created at 10 Jun · 8:06 PM1 source↑ Market-relevant
IN SHORT

SK Group Chairman Chey Tae-won announced SK Hynix will triple its wafer capacity by 2034 to meet surging demand for AI memory chips. This marks a significant increase from previous plans to double capacity within five years, driven by persistent shortages and customer pressure, including a direct request from Nvidia CEO Jensen Huang.

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Key Numbers

2034SK Hynix wafer capacity target year
3xPlanned wafer capacity increase
2030Projected end of memory shortage
20%Projected wafer supply deficit
5 yearsPrevious capacity expansion timeline
3 yearsTime to build new fab from existing site
5 yearsTime to build greenfield facility
60-70%SK Hynix's reported HBM4 orders for Nvidia's Vera Rubin platform

Who's Involved

Chey Tae-won
Chairman of SK Group and SK Hynix
SK Hynix
South Korean memory chip manufacturer
Nvidia
World's dominant AI chip designer
Jensen Huang
CEO of Nvidia
TSMC
Taiwanese semiconductor foundry
SK Hynix to triple wafer capacity by 2034 amid AI demand

↳ Why This Matters

The expansion plans by SK Hynix signal a significant investment in the AI infrastructure backbone, directly addressing the critical shortage of HBM chips. This move is crucial for Nvidia and other AI developers to meet accelerating demand for AI accelerators, potentially impacting the pace of AI development and deployment globally.

Key facts

  • SK Hynix plans to triple its wafer capacity by 2034 to meet AI chip demand.
  • Chairman Chey Tae-won forecasts memory shortages, including HBM, will continue until 2030.
  • Nvidia CEO Jensen Huang publicly urged SK Hynix to increase production.
  • SK Hynix's 2026 HBM output is already sold out.
  • Japan is considered an ideal location for SK Hynix's future overseas expansion.

SK Group Chairman Chey Tae-won announced that SK Hynix intends to triple its wafer capacity by 2034, a significant expansion driven by the escalating demand for high-bandwidth memory (HBM) chips essential for artificial intelligence computing. This ambitious plan represents a substantial increase from earlier projections to double capacity within the next five years.

Chey reiterated his forecast that a structural memory supply shortage, particularly for HBM, is likely to persist through 2030, with industry-wide wafer supply potentially falling more than 20% below demand. He highlighted that the production of HBM consumes considerably more wafer capacity per bit compared to conventional DRAM, and that building new fabrication facilities is a lengthy and costly process, taking at least three years from an existing site and over five years for a greenfield location.

The urgency for increased production was underscored by Nvidia CEO Jensen Huang, who visited the SK Hynix booth at Computex 2026 and publicly inscribed "Please Make More" on an HBM4E wafer. This direct appeal from a key customer, whose platforms are heavily reliant on HBM, emphasizes the critical supply constraints. SK Hynix's entire HBM production for 2026 is reportedly already sold out, and some customers have reportedly offered to prefund new production lines due to the near-zero available capacity.

Chey also indicated that Japan is a strong candidate for SK Hynix's future overseas manufacturing operations. He noted ongoing collaborations with partners such as TSMC, Foxconn, and Acer, emphasizing the need for expanded partnerships as the AI business grows. Chey suggested that South Korea could learn from Taiwan's proactive embrace of the AI era and accelerate its own response.

Frequently asked questions

SK Hynix aims to triple its wafer capacity by 2034 to meet the soaring demand for high-bandwidth memory (HBM) chips crucial for AI computing.

SK Group Chairman Chey Tae-won projects that the memory supply shortage, including HBM, will persist through 2030.

At Computex 2026, Jensen Huang visited the SK Hynix booth and wrote 'Please Make More' on an HBM4E wafer, publicly urging the company to increase production.

HBM consumes significantly more wafer capacity per bit than conventional DRAM, and building new manufacturing facilities is a time-consuming and expensive process.

What Happens Next

01SK Hynix will proceed with investments to build new fabrication facilities.
02The company will continue to collaborate with partners like TSMC, Foxconn, and Acer.
03SK Hynix will evaluate Japan as a potential location for overseas expansion.

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Cadence

How It Developed

SK Group Chairman Chey Tae-won stated SK Hynix will triple its wafer capacity by 2034.
Chey reiterated a forecast that memory supply shortages will persist through 2030.
He previously announced plans to double SK Hynix's wafer production capacity within five years.
Nvidia CEO Jensen Huang visited the SK Hynix booth at Computex 2026 and wrote 'Please Make More' on an HBM4E wafer.
SK hynix's entire 2026 HBM production is reportedly sold out.
Customers have reportedly offered to purchase SK Hynix's EUV lithography scanners and prefund new production lines.
Chey indicated Japan is an excellent candidate for SK Hynix's overseas expansion.
He also mentioned meeting with partners like TSMC, Foxconn, and Acer in Taiwan.

Sources

T1
SK Hynix to triple wafer capacity by 2034: Chairman CheyNikkei Asia
T2
Chey Tae-won warns HBM shortage through 2030, doubles SK hynix capacity ...biz.chosun.com
T2
SK hynix Doubles Wafer Capacity: Huang Writes 'Please Make More' at ...techtimes.com

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