Key facts
- Intel's EMIB-T packaging technology is reportedly gaining traction with Google.
- This is seen as an alternative to TSMC's CoWoS technology for assembling AI chips.
- Google is expected to be a major customer for Intel's EMIB technology.
- The adoption is linked to strains on TSMC's packaging resources due to high AI demand.
- Powerchip Semiconductor and AP Memory are mentioned as potential suppliers for Google's TPUs using EMIB-T.
The intense demand for AI chips is creating bottlenecks in semiconductor packaging, particularly for TSMC's CoWoS technology. This situation is opening doors for alternative solutions like Intel's EMIB-T. Google's potential adoption of EMIB-T for its custom TPUs, along with the involvement of Taiwanese suppliers, highlights the competitive landscape and the strategic importance of advanced packaging in the AI hardware supply chain. Google's increased capital expenditure on AI is expected to boost the data center infrastructure and TPU supply chain stocks, signifying a growing demand for advanced computing resources.