Key facts
- Rivvor has introduced a sub-terahertz wireless interconnect technology.
- The technology is designed for AI data centers.
- It aims to address scale-up and scale-out connectivity in high-density AI racks.
- The solution is engineered for both Earth-based and orbital applications.
Rivvor, a deep-tech startup, has introduced a sub-terahertz wireless interconnect technology aimed at AI data centers. This new wireless chipset is positioned to integrate into the AI interconnect stack, offering an alternative to traditional copper and optical links. The technology is designed to address the increasing demands for scale-up and scale-out connectivity within high-density AI racks. Furthermore, Rivvor's solution is engineered for deployment in both terrestrial data centers and potentially in orbital environments.